Nvidia, Amkor Ink $1.5 Billion Chip Packaging Deal
Synopsis
The multi-year agreement will expand advanced semiconductor packaging and testing capacity in the U.S. to meet rising AI demand
Key Highlights
- Nvidia has signed a US$1.5 billion multiyear deal with Amkor Technology
- Advancing semiconductor packaging and testing capacity in the US.
- Partners with the high demand in AI infrastructure
Amkor Technology has partnered with Nvidia in a US$1.5 billion multi-year deal to expand USA advanced semiconductor packaging and testing capacity. Under the deal, Nvidia will pay a deposit to fund Amkor’s advanced packaging expansion including in Arizona.
Focus on AI Chip Packaging
The companies will work together to produce packaging and testing technologies designed for Nvidia’s AI and accelerated computing platforms. The collaboration will involve putting multiple types of chips into a single package.
Amkor already supplies advanced packaging for Nvidia’s data centre processors, with the new expanded agreement targeting the latest packaging technologies to better meet demand as infrastructure needs driven by AI continue to climb.
Existing Partnerships
TSMC and Amkor signed a 10-year partnership between the two in June, just as both companies aim to strengthen their multi-year semiconductor packaging presence within the United States. It also collaborates with AMD to package its chips.
Source: Reuters
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